| Putanga - Kua tohua: | 500 ~ 3000 V (3kV) |
|---|---|
| Te manawanui: | ±5%, ±10% |
| Raupapa: | - |
| Maha: | 400 Pcs (20 Per Value) |
| Packaging: | Binder |
| Ngā Packahinga Kei roto: | 0805 ~ 2225 (2012 ~ 5763 Metric), Radial |
| Momo Tae: | Surface Mount, Through Hole |
| Momo Kit: | Ceramic |
| Ngā āhuatanga: | High Voltage |
| Waea Whakaaetanga: | 100pF ~ 0.1µF |
| Nga tono: | General Purpose |
CER ENG KIT 23
CAP KIT CER 1000PF-4.7UF 1900PCS
CER ENG KIT 03
CAP KIT CERAMIC 1.5PF-1UF 2000PC
CER ENG KIT 21
CAP KIT CER 100PF-22UF 1850PCS
CER ENG KIT 06
CAP KIT CERAMIC 1PF-0.1UF 2000PC
CER ENG KIT 05
CAP KIT CERAMIC 10PF-10UF 2000PC
CER ENG KIT 04
CAP KIT CERAMIC 10PF-10UF 2000PC
CER ENG KIT 24
CAP KIT CER 270PF-0.47UF 1275PCS
CER ENG KIT 07
CAP KIT CER 0.01UF-47UF 400PCS
CER ENG KIT 09
CAP KIT CERAMIC 0.01UF-1UF 200PC
CER ENG KIT 10
CAP KIT CERAMIC 200PCS
M2GL010TS-1VFG400
IC FPGA 195 I/O 400VFBGA
M1A3P400-FG484
IC FPGA 194 I/O 484FBGA
XA7A15T-2CSG324I
IC FPGA 210 I/O 324BGA
XA6SLX16-3CSG324Q
IC FPGA 232 I/O 324CSGBGA
LFE2-20SE-7FN484C
IC FPGA 331 I/O 484FBGA
XC7A50T-1FG484C
IC FPGA 250 I/O 484FCBGA
A42MX09-FTQG176
IC FPGA 104 I/O 176TQFP
AGL600V5-FG256I
IC FPGA 177 I/O 256FBGA
M2GL060T-VF400
IC FPGA 207 I/O 400VFBGA
M2GL060T-VFG400
IC FPGA 207 I/O 400VFBGA
